SMD Semiconductor to provide chip design services to Germany’s X-FAB
Published on: Monday, March 27, 2023
By: Bernama
SMD Semiconductor’s collaboration with X-FAB Global Services will make Sarawak a major player in the semiconductor global supply chain.
KUCHING: Sarawak Microelectronics Design (SMD) Semiconductor Sdn Bhd, a wholly-owned subsidiary of Sarawak Research and Development Council (SRDC), signed a framework services agreement (FSA) with Germany’s X-FAB Global Services to provide chip design services.
The agreement was signed today by SMD Semiconductor CEO Shariman Jamil, its director Dr Peter Morin Nissom, X-FAB Group CEO Rudi de Winter and group chief technology officer Joerg Doblaski.
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Through the agreement, SMD Semiconductor will render chip design to X-FAB to develop X-FAB’s latest silicon IP libraries for their advanced process technology node migration.
“This activity also aligns with X-FAB’s expansion plan at (its) Samajaya facility in Kuching to increase the foundry output from 30,000 to 40,000 wafers per month by 2025,” SMD Semiconductor said in a statement today.
The FSA exchange ceremony was witnessed by Sarawak premier Abang Johari Openg, state education, innovation and talent development minister Roland Sagah Wee Inn, X-FAB Silicon Foundries SE chairman Hamid Bugo, and other senior state officials.
Meanwhile, Abang Johari said the agreement also signified the Sarawak government’s commitment to gear its industry towards Industrial Revolution 4.0 (IR4.0) and a high-value economy.
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He also hoped that Sarawakian semiconductor professionals working overseas would return to contribute to the state’s industry through this initiative.
“SMD Semiconductor’s collaboration with X-FAB Global Services will make Sarawak a major player in the global supply chain and enable higher skilled job creations,” he added.
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